Cover of an electronic device having surface ornamentation



The present application is related to copending U.S. patent applicationSer. Nos. 29/415,338, 29/415,537, 29/415,532, 29/415,534, 29/415,340,29/415,530, 29/415,529, 29/415,528, 29/415,526, 29/415,523, 29/415,521,29/415,634, 29/415,633, 29/415,520, 29/415,632, 29/415,631, 29/415,629,29/415,628, 29/415,635, 29/415,630, 29/415,636, each entitled “Cover ofan Electronic Device Having Surface Ornamentation”, by Bin Li. Theseapplications have the same assignee as the present application and havebeen concurrently filed herewith. The above-identified applications areincorporated herein by reference.

FIG. 1 is a perspective view of a cover of an electronic device havingsurface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4in FIG. 2.

In FIGS. 1-3, the evenly segmented broken lines indicate portions of thecover of an electronic device having surface ornamentation that form nopart of the claimed design. In FIGS. 2 and 4, the unevenly segmentedbroken lines indicate the portion of the cover of an electronic devicehaving surface ornamentation that is shown on an enlarged scale in FIG.4. The broken lines form no part of the claimed design.

The ornamental design for a cover of an electronic device having surfaceornamentation, as shown and described.